SMT and Mixed Technology Assembly Skip Navigation Links       


  New England CM uses Mydata MY9 automatic pick and place equipment. The MY9 has exceptional changeover versatility as well as the capability of placing a range of components from fine-pitch, BGAs, flip chips to 0201s at a rate of 14,000 cph. Screen printing is performed using an EKRA X1 semi-automatic screen printer capable of screening flexible and rigid materials with a thickness up to 25.4 mm. Paste height, registration, and other printing parameters are tested using the CyberOptics LSM2 paste measuring system. Solder reflow is provided by a Conceptronic HVA-102 7-zone reflow oven. The HVA-102 is well suited for reflow temperatures required for RoHS compliant components and PCBs. Thru-hole components are added by our staff of highly qualified solderers.